High Speed Designs
DDR 3 Chip-on-Board High Speed Routing
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Scope of Work:
Services Provided:
| • | DDR3 Memory Chip-on-Board |
| • | .8mm mirrored BGA's |
| • | 10 Layer HDI Tech |
| • | Laser Via-In-Pad Technology |
| • | Multiple Impedance Stack-up, differential and single-ended. |
| • | High Power Switcher on Board |
| • | Printed Circuit Board Design |
| • | Power distribution calculations |
| • | Impedance stack-up calculations |
| • | Rules driven routing and verification |
