| • | DDR3 High Speed Technology |
| • | 244 pin Memory DIMM's |
| • | 22 Layer Blind and buried Vias |
| • | Signal Speed of 1.6 Mb/s |
| • | Multiple Impedance Stack-up |
| • | High Power Switcher on Board |
| • | Printed Circuit Board Design |
| • | Power distribution calculations |
| • | Impedance stack-up calculations |
| • | Rules driven routing and verification |