High Density Interconnect Designs
Digital/Analog Layout with .8mm BGAs
Scope of Work:
Services Provided:
| • | High Density Interconnect Board Layout |
| • | High Speed RS-485 Communication Buss |
| • | Fine Pitch BGAs (.8mm pitch) |
| • | Analog/Digital Isolation |
| • | Component Height Restrictions Rules |
| • | Breakaway Manufacturing Rails Added |
| • | 12 Layer Controlled Impdedance Stack-Up |
| • | Printed Circuit Board Design |
| • | Analog/Digital Isolation Strategy |
| • | Controlled Impedance and Stack-Up Calculations |
| • | Design with-out using Blind or Buried Via Tech |
| • | 100% In-Circuit Test Point Coverage |
| • | Prototype Fabrication and Assembly Services |
